[Murata Product] Murata Commercializes a Compact and Multi-Functional …
- Writer : 최고관리자
- Date : 25-07-21 15:23
- Hit : 17회
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Murata Manufacturing Co., Ltd. (hereinafter "Murata") has developed and begun mass-producing the compact wireless module “Type 2FY” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW55513” Wi-Fi™/Bluetooth®/Bluetooth® Low Energy combo chip that supports Wi-Fi 6E.
With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. For this reason, performances such as low latency, multi-connectivity, and connection stability for wireless connections have become increasingly important.
In response, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW55513 built in. Compatible with 2.4GHz, 5GHz, 6GHz tri-band Wi-Fi 6E and contributes to network efficiency enhancement. Supports LE Audio*1, A2DP*2, and HFP*3 for the Bluetooth® function and contributes to achieving quality voice communication.
Furthermore, this product was designed*4 to be pin compatible with Murata’s conventional Type 1MW (CYW43455) and customers using the conventional Type 1MW can simply replace their old product with the Type 2FY without having to update to new hardware designs.
Additionally, this product achieved a smaller size by applying Murata’s proprietary packaging technology, space-saving design, and products to offer high performance wireless communication functions. Through this compact design, its application into various IoT devices has become easier and new application developments are expected to occur.
Furthermore, though this product is based on the Wi-Fi 6E standard, by limiting the bandwidth to a 20MHz compliant bandwidth, it has become cost-friendly. We are now capable of providing superior Wi-Fi 6E performances while keeping costs down.
Murata will continue aiming to achieve smart life creations by providing performances required on next generation IoT devices at a cost that suits the market needs.
- *1LE Audio: Next generation Bluetooth®standard. Enables high-quality audio streaming with low power consumption.
- *2A2DP: A Bluetooth®profile for audio streaming.
- *3HFP: A Bluetooth®profile for audio communication.
- *4Same size and same rear terminal shape as Type 1MW.
| Product name | LBEE5HY2FY |
|---|---|
| Type | Type 2FY |
| IC Manufacturer | Infineon |
| IC product name | CYW55513 |
| Technology | Wi-Fi™ and Bluetooth® |
| Wi-Fi™ | Wi-Fi 6E (802.11ax) |
| Wi-Fi™ frequency band | 2.4GHz, 5GHz, 6GHz |
| Bluetooth® | 5.4 BR/EDR/Low Energy |
| Host interface (Wi-Fi™) | SDIO |
| Host interface (Bluetooth®) | UART |
| Built-in antenna | None |
| Dimension | 7.9 x 7.3 x 1.1 mm Approximately 0.31 x 0.29 x 0.04 inches |
| Supply voltage | 3.0 to 4.8 V |
| Interfacing voltage | 1.8 V |
| ISED (radio communication regulation for Canada) certification | Certified |
| FCC (radio communication regulation for the U.S.) certification | Certified |
| ETSI (radio communication regulation for Europe) report | Prepared |
| Japan Radio Law certification | Certified |
| Operating temperature range (°C) | -40°C to +85°C |
Product pages
For details on this product, see here.
Source : Murata
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